Low Force Bonders | High Force Presses | R&D Presses

Sintering Solutions

Sintering Die Attach

https://pixabay.com/photos/passenger-train-sbb-train-3389699/Sintering is the process of compacting and forming a void-free, solid joint by heat and pressure without melting it to the point of liquification. Due to the increasing electrical and operating temperature requirements of high power devices, conventional solder materials do not always provide the optimal die-attach solution. While sintering of powders is not a new technology, the utilization of sintering for die-attach is still a relatively young and emerging technology. Some of the markets for this technology include the aerospace, locomotive, & automotive industries. The worldwide push to develop more efficient EV and Hybrid EV vehicles, for example, requires improving the reliability and efficiency of high current switching devices which are constantly cycled on and off. Depending on the materials selected, Sintering Technologies have the ability to greatly improve die-attach reliability with some key advantages:

  • Void-Free & Lead-Free Bonds - improved reliability & performance of component
  • Improved Thermal Conductivity - thermal conductivities up to 300 W/mK are possible
  • Reduced Electrical Resistance - Ag & Cu Sintering Materials offer excellent electrical performance
  • Absence of "Solder Fatigue" - the breakdown of the bonded joint after thermal & electrical cycling
  • Higher Melting Point of Bonded Materials - allows for higher operating temperatures of the final component

Materials used for Sintering Die-Attach include many forms of Paste, Die-Transfer Films, or even Preform formats on tape & reel. Substrates for Sintering Die-Attach are typically Direct Bonded Copper (DBC) - sandwiched copper layers with a middle ceramic layer (AlN). One example of a sintering material used is Argomax®, an Alpha Assembly Solutions product, which is available for both Silver and Copper Sintering. As a reference, some of Argomax®'s product specs. include: High Thermal Conductivity Bond Lines ~250 W/mK, Bond lines from 5µm to 100µm, Pressures around 5-10 MPa or higher, & Process Temps from 190°C to 300°C.

Sintering Fig. Densification & Grain Growth at the Sintered Die-Attach Interface
Infotech Sinter Bonder

Infotech Sinter Die Bonder

Low Force Sintering & "Tacking"

Infotech's Sinter Die Bonder is a highly flexible die-bonder featuring heated sintering heads with temperatures up to 300°C, force capabilities of 300N (optional 500N), heated substrate holders, as well as access to Infotech's Standard Component Matrix. Small dies, such as LED's, can be fully sintered or large dies can be accurately "tacked" onto the substrate before entering a sintering press. Batch assembly or in-line solutions are possible. Sinter Die Bonder (Infotech)

AMX Automatrix Presses

AMX Automatrix Sintering Presses

High Force Sintering

Air-Vac Automation is the North America Representative of AMX Automatrix. AMX is an emerging Italian company, providing high force sintering presses for die-attach. Their patented technologies feature adaptive height control for sintering different thickness dies, as well as several advancements to reduce equipment maintenance downtime. R&D Presses and Multi-Punch Production Presses are available with forces up to 40 MPa (16 kN). Sintering Presses (AMX Automatrix)