- Automotive Industry - Sensors & Power Modules for electric vehicles...
- Photonics & Optoelectronics - Laser Diode & Optics Assembly...
- Semiconductor Industry - Power Diode Assembly & Wafer Die Handling...
- Electronics/Surface Mount Devices - Assembly, Soldering, & Rework...
- Micro-Mechanics & Watch - Gears, Pins, Mems, & Watch Assembly...
- Biotechnology & Pharma - Dispensing, Assembly, & Packaging...
Today's vehicles rely on countless sensors and electrical systems to ensure passenger safety and vehicle performance. The assembly and joining techniques for these systems require the highest demand of the manufacturing quality, reliability of the equipment, and stability of the process.
Most applications in the automotive industry, such as the assembly of power modules, are a combination of dispensing, placing, bonding, and assembling processes - a perfect fit for Infotech's equipment. Infotech has extensive experience developing equipment and new technologies for the automotive supplier industry as well as meeting their quality requirements. Infotech provides a complete solution from prototype equipment to full production lines.
Photonics & Optoelectronics
Photonics applications rely on an optical component (lens, mirror, etc...) that is aligned to a beam path and bonded with a dispensed UV curing adhesive. Typical applications include kitting and sorting of optical components, highly accurate assembly of VCSEL(vertical-cavity surface-emitting laser) diode on submounts, and active/passive alignmnet of an optic or electronic transmitter-receiver system.
Infotech's robot platforms are equiped with four axes of movement: X, Y, Z, and Theta. However, they can be expanded with additional axes systems and 3D tilt stations to allow for control of Roll, Pitch, and Yaw of a substrate. When bonding a diode to a submount, for example, it is important to control and maintain the plane-parallelism between the submount and diode. Combined with other control systems, such as force feedback, temperature feedback, and full motion control, Infotech equipment is able to provide void-free bonding of components.
Infotech's expansive component matrix allows for many semiconductor applications that are difficult or impossible with standard machines. Handling and bonding components as small as 150um, active control and correction of plane-parallelism, UV dispensing and curing, Eutectic bonding, chip-on-chip, chip-on-wafer, as well as processesing of very thin wafers are within Infotech's area of expertise.
Infotech equipment is clean room compatible with the capability to automatically handle wafers as large as 300mm. Furthermore, the software flexibility allows for application-specific solutions such as handling wafer map data, traceability, and communication with external host systems via SECS/GEM commands.
Electronics/Suface Mount Devices
Today's electronic manufacturing means more than just classic assembly of a printed circuit board with SMD parts. As the electronics industry combines processes from different technologies, it is harder to assemble components with off-the-shelf machines. Infotech capabilities range from real 3D assembling to dispensing and soldering. Several different heaters (hot gas heads, contact heater heads, eutectic ovens, preheaters, hot plates, etc...) can be combined inside a system to realize a process. Furthermore, the software flexibility allows for unique application-specific solutions.
One application example includes the evolving Micro LED Industry. Infotech's equipment has the capability to remove damaged components, re-paste sites, and solder a new component that is provided to the machine on wafer, waffle, tape, etc... with extremely high accuracy.
Micro-Mechanics & Watch
The handling of gears, pins, mini chain-links, and small mechanical components are within our area of expertise. Our expansive component matrix combined with our high speed and accurate robot platforms allow us to feed and handle almost any type of component.
Infotech's core competencies include a range of applications such as the fully automatic assembly of movements, dials, and glasses in watches. All process steps are supported by the vision system, which is able to execute measurements, provide after-mounting quality controls, or perform inspection tasks. While Infotech has an expansive list of machine peripheral options, Infotech is always willing to integrate customer-chosen hardware into the final system.
Biotechnology & Pharma
Infotech understands and meets the strict guidelines for automation projects in the Biotechnology and Medical industries. Infotech is compliant with the GAMP guideline, tight project organization, and structured documentation provided with each project. Furthermore, system peripherals can be adapted to medical grade materials for handling of medical and drug-related components.
A variety of applications range from manufacturing of implants and blood-analyzers to the inspection and packaging tasks for assembly of asthma inhalers. The system's powerful software allows for many unique processes, such as 3D bio-dispensing, and customized traceability. Infotech equipment is clean room compatible and the expansive machine peripheral options allow for almost unlimited possibilities.