Partners in Automation The Assembly Show
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•   Power Modules for Hybrid and Electric Vehicles

•   Braking and Safety Systems

•   LIDAR and Other Sensors

•   Inspection and Testing

•   Telecomunications

•   Fiber Optic Lasers

•   Component Assembly and Packaging

•   Inspection, Sorting, and Testing

•   Die Ejection, FlipChip and Wafer Handling

•   DieBonding - Eutectic/ Ultrasonic/ UV

•   Dispensing - Epoxy Attach

•   Inspection, Sorting, and Testing

•   Surface Mount Components

•   Dispensing - Underfill and Encapsulation

•   Microbatteries

•   Device Assembly

•   Inspection, Sorting, and Testing

•   Watch Industry

•   MEMS Devices

•   Assembly and Packaging

•   Dispensing

•   SECSGEM Communication and Full Traceability

•   Assembly and Packagaing

Pick ab Wafer


•   MATERIAL HANDLING (Wafers, Transport Systems...) •   PICKING (Bulk, Waffle, Preform, Tape, Die-Ejection...) •   PLACING (Waffle, Tape, GelPak, Flippers...) •   DISPENSING (Jet, Micro-Screw, Time/Pressure, Pin Transfer...) •   BONDING (Die Attach Processes) •   ASSEMBLY (Fully Automated Production Process)

Trays: Loading and unloading systems are available for formats of palettes such as 2” or 4” Waffle Trays, JEDEC Trays and many others. The handling of palettes is extremely smooth and shock-free. We also offer customer specific solutions for non standard systems and integration with in-line systems.

Wafers: The wafer with sawn dies mounted on adhesive foil is fed to the machine on a fully-automated or semi-automated basis. Different frame types such as Disco, K&S, or ER expansion rings are supported.

For the handling of parts, normally vacuum nozzles are used with a broad variety of standard nozzles and custom tools. For the handling of exotic or extremely sensitive parts, there is also the possibility of using vacuum driven grippers. Ionizers, Observer Cameras, and more can be integrated to assist with the handling of parts.

The Component Matrix allows assembly processes that go far beyond the standard. For example, parts can be placed on the substrate based on their structure or aligned relative to already placed parts. Components can be flipped or even assembled on tilt stations. Besides precision in X and Y, the angular resolution often plays a central role. Assembly heads with backlash-free gears and high resolution encoders allow an extremely high placement accuracy.

A wide selection of dispensing valves from different manufacturers – time/pressure, precision micro-screw, jet dispense valves, and piston valves – are available. In combination with the integrated vision system, standard applications such as Underfill, Glob-Top or Conformal Coating are possible, as well as complex 2D or 3D dispensing tasks.

Several bonding processes are available on Infotech systems - Eutectic/Thermo-Compression Bonding, Sintering, UV Curing Ovens, Bottom Heaters, Ultrasonic Bonding, In-Line Vacuum Ovens, Heated Bond-Heads, and more. We can combine these options with other stations, peripherals, and material handling options to meet your process needs.

Multiple processes such as assembling, dispensing, measuring, curing, die-bonding, etc… can be mounted together in one system. The compactness allows us to provide a complete production process on fewer machines than it would be possible with standard equipment, reducing footprint and cost. The head configuration and machine layout are always adapted to the process in order to optimize cycle time. Units can work autonomously, allowing processes to work in parallel with high speed and precision.

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