Material Handling:

Dispensing Systems

Full Traceability:

A wide range of material handling systems can automatically exchange up to 12" wafers, waffle packs, JEDEC trays, and more. Wafer dispensing features include automatic plane compensation, wafer map import, and more.

Air-Vac Automation and Infotech AG are partners in manufacturing highly flexible and customizable automation equipment. We have more than 1,600 systems installed worldwide and more than 36 years of experience.

Process control and traceability on our equipment is highly flexible. Inspections and generated logs/reports can be customized to the application requirements. SECS/GEM communication is also possible for further machine control.

Medical Device Automation

Polyimide Dispensing - Jet Dispensing & Curing

System Example

Polyimide Jet-Dispenser using Liquidyn P-Jet, Nitrogen Clean module, Substrate Heater, Optional Load-and Unload module

  • +/- 10µm @3sigma with possibility of <5µm accuracy
  • 3 m/s Robot Speeds - Vision, Pick, Vision, Place ~1 s or faster
  • Highly Flexible Programming and Customization
  • Pick, Place, Dispense, Bond, Cure, Inspect
  • Fully Automated Material Handling Systems
  • Full Process Control & Traceability
  • Infotech

    Meeting your Application Needs

    Unparalled Flexibility

    Our systems feature more than 1,000 peripheral options. If we don't already have a peripheral designed, then we will readily design and manufacture a new one or integrate a third party unit to meet your application requirements.

    Furthermore, we can readily customize our already very flexible software platform to incorporate custom functions, interfaces, motion, and logic. Our proprietary softare supports hundreds of programs and limitless sequencing options.

    Various Dispensing Processes

    Automated Dispensing

    Multiple machines can be connected in-line to each other as well as to third party machines to form a complete production line. Individual production cells range from 900 mm up to 2,000 mm footprints. Small tabletop platforms are also available for lower volume production and R&D tasks. Systems are standard ISO 7, but can be configured down to ISO 6 compatibility.

    3 Dispense Heads & UV Curing

    Additive Dispensing

    A variety of dispenser types (Time/Pressure, Auger Screw, Jet, 2-Part...) can be combined on a system with curing systems and assembly heads. Example applications include dispensing 2D dots/lines on wafer locations, or even 3D dispensing of components and structures. Vision, Laser Sensors, Weight Scales, and more can be utilized for process verification.

    Flyers & Brochures

    Dispensing Systems
    Assembly Systems
    Die-Attach Systems
    Company Brochure