Assembly Options

Die Sorting Systems

Full Traceability:

Prior to sorting, components can be pre-treated with various processes - dispensing, oiling, plasma cleaning... Components can also be partially or fully assembled with a variety of bonding processes prior to sorting. Final outputs include waffles, trays, JEDEC, or even re-taping components into tape and reel.

Air-Vac Automation and Infotech AG are partners in manufacturing highly flexible and customizable automation equipment. We have more than 1,600 systems installed worldwide and more than 36 years of experience. Our die sorting machines are available for multiple applications and markets.

Process control and traceability on our equipment is highly flexible. Inspections and generated logs/reports can be customized to the application requirements. SECS/GEM communication is also possible for further machine control. The customer has full controll of all speeds, delays, temperature, and more.

Die Sorting Systems

Bulk Sorting to Tray

System Example

  • +/- 10µm @3sigma with possibility of <5µm accuracy
  • 3 m/s Robot Speeds - Vision, Pick, Vision, Place ~1 s or faster
  • Highly Flexible Programming and Customization
  • Multi-Functional Systems - Pick, Place, Dispense, Bond, Cure
  • In-line Conveyors & Fully Automated Material Handling
  • Full Process Control & Traceability
  • Infotech

    Meeting your Application Needs

    Unparalled Flexibility

    Our systems feature more than 1,000 peripheral options. If we don't already have a peripheral designed, then we will readily design and manufacture a new one or integrate a third party unit to meet your application requirements. Furthermore, we can readily customize our already very flexible software platform to incorporate custom functions, interfaces, motion, and logic.

    In-Line Production Line

    Company Presentation

    Multiple machines can be connected in-line to each other as well as to third party machines to form a complete production line. Individual production cells range from 900 mm up to 2,000 mm footprints. Small tabletop platforms are also available for lower volume production and R&D tasks. Systems are standard ISO 7, but can be configured to ISO 6 cleanroom compatibility.

    Application Examples

    Die Sorting Systems

  • Automatic Material Handling Systems
  • Bulk Feed, Tray Feed, Wafer Feed Components down to 0.1mm
  • Wafer Map Import and Automatic Alignments
  • Kitting to waffle tray, gel pack, JEDEC, re-taping parts...
  • Treatment & Pre-Assembly of Kitted Parts
  • Highly Flexible and Custom Configurations
  • Flyers & Brochures

    Die Sorting Systems
    Assembly Systems
    Dispensing
    Company Brochure