Material Handling:

Assembly Systems

Full Traceability:

A wide range of material handling systems can automatically exchange up to 12" wafers, waffle packs, JEDEC trays, preforms, bulk material, and more. Automatic tooling exchangers and calibrations are standard.

Air-Vac Automation and Infotech AG are partners in manufacturing highly flexible and customizable automation equipment. We have more than 1,600 systems installed worldwide and more than 36 years of experience.

Process control and traceability on our equipment is highly flexible. Inspections and generated logs/reports can be customized to the application requirements. SECS/GEM communication is also possible for further machine control.

Package Assembly System

Hybrid Package Assembly

System Example

Hybrid Packaging & multi-component assembly, dispense, pick and place

  • +/- 10µm @3sigma with possibility of <5µm accuracy
  • Fiducial Alignments, Custom Inspections, and Logic
  • Highly Flexible Programming and Customization
  • Pick, Place, Dispense, Bond, Cure, Inspect
  • Fully Automated Batch Processing
  • Full Process Control & Traceability
  • Infotech

    Meeting your Application Needs

    Unparalled Flexibility

    Our systems feature more than 1,000 peripheral options. If we don't already have a peripheral designed, then we will readily design and manufacture a new one or integrate a third party unit to meet your application requirements.

    Furthermore, we can readily customize our already very flexible software platform to incorporate custom functions, interfaces, motion, and logic. Our proprietary softare supports hundreds of programs and limitless sequencing options.

    In-Line Production Line

    Company Presentation

    Multiple machines can be connected in-line to each other as well as to third party machines to form a complete production line. Individual production cells range from 900 mm up to 2,000 mm footprints. Small tabletop platforms are also available for lower volume production and R&D tasks. Systems are standard ISO 7, but can be configured down to ISO 6 cleanroom compatibility.

    Pick, Place, Jet Dispense

    Optoelectronics Assembly

    Photonics applications rely on an optical component (lens, mirror, etc...) that is aligned to a beam path and bonded with a dispensed UV curing adhesive. Typical applications include kitting and sorting of optical components, highly accurate assembly of VCSEL(vertical-cavity surface-emitting laser) diode on submounts, and active/passive alignmnet of an optic or electronic transmitter-receiver system.

    Flyers & Brochures

    Assembly Systems
    Dispensing Systems
    Die-Attach Systems
    Company Brochure